Performance and Application News about ORMECON CSN

Many actual and potential customers visited Ormecon's booth at productronica 99, Munich. Several news are of broader interest:

Korea:
A first production of multilayer boards using ORMECON CSN as bonding agent, replacing "white oxide" or "black oxide"; the new technique offers a very high reliability.

Europe:
The adhesion of solder masks can be significantly improved with a pretreatment by ORMECON PCB 7000.

The adhesion of dry film photoresist was significantly improved by a pretreatment with ORMECON PCB 7000.

Japan:
A first line will soon be installed.

Taiwan:
A first test line will soon start to run with ORMECON CSN; a sales and marketing agreement is in preparation.

worldwide:
The performance of ORMECON CSN lines has been proven to be free of problems; irrespective of whether used continuously or discontinuously, customers say the lines are running easy, reliably and very efficiently. No special attention must be paid to copper concentration, no regular tin bath recovery or exchange is necessary. During use, only evaporation, drag-out and tin use has to be compensated for according to the prescriptions. The bath use is then quasi "unlimited".