recent results presented at LT 22 (Aug 1999,
Finland) |
| First direct application: low Temperature
sensor made from metallic PAni blend / ICEC 18, Feb 2000, India |
Dr. Bernhard Wessling
Ormecon Chemie
Synthetic Metals 102 (1999) 1396-1399
Dispersion shifts Polyaniline to the metallic side of the
"Insulator-to-Metal(1M)-Transition" / Crystal structure revealed
This is the abstract of an oral presentation, presented at ICSM 98 in Montpellier.
The full text is available as a preprint version on request.
Full paper to be published
Conductive Polymers like Polyaniline are principally insoluble, which can be deducted
from several basic thermodynamical considerations. Therefore, dispersion is the
appropriate way of processing ICPs and PAni. We have shown earlier, that certain
thermoplastic blends of PMMA (60%) and polyaniline (40%) have been 10 times more
conductive than the starting raw PAni powder, had a partially metallic
conductivity/termperature dependance and a much higher reflectance, although PAni was the
minor component. The Morphological nanostructures responsible for this will be shown.
Low temperature conductivity measurements and the calculation of the reduced activation
energy [W = dln(sigma) / dln(T)] showed, that these blends are clearly on the
metallic side of the IM transition, whereas the starting raw powder is on the insulator
side. This is the first time, that polyaniline was found there reproducibly and under
ambient conditions. We have analyzed the reasons for this change and found, that one
prerequisite is a very high - the highest ever found in ICPs - density of states at the
Fermi energy, the other is dispersability, and the dispersion step leads to a new crystal
structure of PAni.
The crystal structure of Polyaniline will be shown, both the "pre-metallic"
form (undispersed), and the metallic form (dispersed), and their dramatic difference will
be explained. The (commercial) dispersion process is obviously accompanied by a shear
induced re-crystallization.
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